Electronic assembly tests

In-Circuit-Test (ICT)

Thanks to the in-circuit test, it is possible to determine the correct functioning of the circuits – before the function of the assembly itself even comes into play.

Our Seica Pilot FX and SPEA 3030 test systems can not only check the component parameters fully automatically, they also test the assembly for short circuits and soldering errors. But that’s not all: programming and functional tests can also be integrated into the ICT process. Incidentally, the SPEA 3030 is currently considered the gold standard in in-circuit testing.

The “flying bed of nails” method provides our customers with high-quality test systems that deliver highly accurate measurement results at comparatively low, product-specific adapter costs.

Functional test

While in-circuit tests are more commonly used for measuring individual component values, the focus of functional testing clearly rests on testing the circuit’s functionality. Here, we work with the MiniTec ATS10 system for example.

Test technology

Nowadays, quality assurance focuses not just on the electrical circuit and component testing but increasingly on material and surface testing too. For this purpose, we offer you test options, such as X-ray tests conducted with the Viscom X8008 X-ray system, measurements using the Keyence IM-6500 system or optical inspections using the Keyence VHX2000 digital microscope.

Whether you want to check the functionality of the circuit as a whole, that of one specific component only or the surface itself – we have the right solution for you: we can develop a custom-designed test procedure for each assembly by working in close cooperation with you and our selected system suppliers.

Thanks to the fully automatic functional test systems, we can offer you cost-effective functional tests even for large series orders.

A practical example of MEC’s Electronic assembly tests :